Become an Exhibitor

Focus on Bonding Technology

The Bondexpo is the worldwide number one user meeting place. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials. This is also true not least for new requirements with respect to resource conservation as well as material and energy efficiency through material mix / hybrid designs for lightweight construction or miniaturisation for microsystems technology applications. Adhesion technology suppliers find the ideal setting here for presentation to the specialist public from the globalised world of production.

Bondexpo runs in parallel with Motek, the international trade fair for assembly, handling technology and automation. The trade fair group is an impressive testament to the need to think outside the box in order to be able to provide a complete representation of the process chains of production and assembly technology including basic bonding and joining technology by gluing.

 

11th Bondexpo

  • Stuttgart

12th Bondexpo

  • Stuttgart

Exhibitor login

This online ordering system offers you convenient online booking and processing of your specialist trade fair appearance at all SCHALL trade fairs as well as automatic integration of your corporate information into the website tools of the respective trade fairs booked.

You can reach our support hotline at +49 (0) 7025 9206-700.

Exhibitor forum

As an exhibitor, you can take advantage of the opportunity of introducing your company to Bondexpo’s expert visitors by means of a presentation at the exhibitor forum.

Become a speaker

Nomenclature

  • Raw materials for adhesives and sealants
  • Machines, systems and accessories for the adhesives manufacturing industry
  • Adhesives and sealants
  • Machines, systems and accessories for the adhesives processing industry
  • Sealing-, measuring and test technology

102 Exhibitors
10 Countries

Exhibitors

35.434 Visitors incl. Motek
90 Countries

Visitors

5.000 sqm
Area gross

sqm

Visitor's Sphere of Interests

67%
58%
32%
30%
29%
16%

Trade fair committee

The Bondexpo – International trade fair for bonding technology will be supported by a world-class trade fair advisory board with members form the industry sector.

Foreign representatives