Bonding – Joining – Fastening

The exhibition portfolio of the Bondexpo international trade fair for bonding technology represents the logical extension of the process sequence for assembly technology. As a thematic and complementary “satellite” of the Motek international trade fair for automation in production and assembly, it covers the fields of joining and fastening by means of bonding, as well as mechanical and thermal joining and fastening technology. Whereas primary attention is focused on the areas of bonding, sealing, insulation, foaming and encapsulation, other mechanical joining and fastening processes (screwing, riveting, clinching, press-fitting and caulking), as well as thermal joining and fastening methods (welding, resistance/spot welding, laser welding, soldering, hard soldering and ultrasound), establish the link to industrial assembly in all fields of application.