Bondexpo would have started today at the Stuttgart Exhibition Centre with a comprehensive portfolio for "smart solutions of bonding technology". Bondexpo project manager Mr. Döring would offer exhibitors and expert visitors from a wide variety of manufacturing industries the first-class service to which Schall is accustomed, and would maintain and expand his customer relationships in an international atmosphere.
However, this is not possible due to the corona-related cancellation of the trade fair. However, Schall acted quickly and set up the Motek 2020 virtually, in order to offer exhibiting companies a valuable and highly functional digital alternative.
At a challenging time, the Bondexpo project manager will provide Schall's marketing team with an insight into the somewhat different trade fair year in a short interview.
Being unable to organise the trade fair, what do you especially miss from your routine everyday project work?
Mike Döring: "The personal contact with exhibitors and visitors, intensive conversations over a coffee to develop the trade fair further and to learn directly from the exhibitor how new trade fair ideas are received by the market."
Which opportunities are offered by Bondexpo-Virtual?
Mike Döring: "The Bondexpo-Virtual is a useful addition to the real Bondexpo, but will by no means replace it. But in the future, such hybrid offerings will be the normal thing."
What would you be doing at Bondexpo right now?
Mike Döring: "After months of planning, it is always an experience when numerous visitors flock to the fair and the stands. Furthermore, it is always an experience when you walk through the halls and theory turns into reality and you can see whether the various ideas work on the exhibition area.
What are you especially looking forward to at the 39th Motek with 14th Blechexpo next year?
Mike Döring: "To my exhibitors and visitors, I really miss this everyday trade fair alone with all its surprises and problems. The smell of a fair etc."
The 39th Motek international trade fair for automation in production and assembly will be held together with its sister event, namely the Bondexpo international trade fair for bonding technology, at the Stuttgart Exhibition Centre from the 5th through the 8th of October.
Further information concerning registration is available here: https://www.bondexpo-messe.de/en/for-exhibitors/
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