Motek/Bondexpo 2020: Digitization becomes practical

Smart Solutions for Production and Assembly: This motto is once again the focus of the 39th Motek – International Trade Fair for Production and Assembly Automation – which, together with the 14th Bondexpo – International Trade Fair for Adhesive Bonding Technologies – is scheduled to take place from 05. to 08 October 2020 in Stuttgart is gearing up. Particular attention is paid to the topics of digitization and networking.

The proven annual industry event Motek/Bondexpo, leading trade fair for the world of automation, is especially anticipated this year. Especially in times of tight economic conditions, industrial users are looking for automation solutions that can be implemented practically in order to be able to implement their respective production tasks efficiently, economically and sustainably. At the core of the product and service portfolio of the globally recognized information, communication and business platform Motek are state-of-the-art components, assemblies, subsystems and complete systems for automated production and assembly. Motek will be showcasing complete solutions for end-to-end automated production with flexible unit numbers that are geared to industrial practice and networked in terms of technology and communication.

As is well known, Motek is firmly marked in the calendar for many companies and established as the strongest and most important trade fair with an international character. Exhibitors and trade visitors alike value it as an ideal platform for presenting technological innovations and discussing application-oriented solutions for present and future production. At the Motek/Bondexpo trade fair duo, trade visitors will find practical topics and their networking as well as realistic process sequences that cannot be seen anywhere else in this holistic form.

Motek/Bondexpo 2020 will again be flanked by the integrative theme park “Arena of Integration” (AoI). Participating companies underscore their globally significant standing by working together with automation partners to develop practical, implementable solutions for everyday industrial use for customers and users. On the one hand, connectivity is put into practice through cooperation, and on the other hand, it results in concrete marketable results. With the AoI concept, trade fair organizer Schall is taking the topic of digitization out of the theoretical corner and putting it directly into practical application.

Joining technology is an elementary component of industrial manufacturing. This is why the proven annual trade fair duo Motek, together with the complementary Bondexpo, has established itself as the industry meeting place. Nowhere else than in this comprehensive range of topics can trade show visitors from the industrial practice get such a comprehensive picture of what the modern, economical production process must look like. With Bondexpo, modern bonding, joining and connection technology gets the industry event it deserves. Here, all processes relevant to adhesive bonding, joining and connection technology are represented in the form of products and services that can be integrated as partial, sub-systems or complete systems. In this context, the adhesives sector is playing an increasingly important role in industrial production. The trade visitor experiences – compactly condensed in one exhibition hall – all the innovations and developments in joining and bonding technology. “Bondexpo is one of the most important trade fairs of the year for us, as this is where we meet exactly the right target group for our company in one place,” explains Andrea Werkmann, Marketing Manager at relyon plasma GmbH in Regensburg. “Here we meet not only our customers, but above all a broad professional audience interested in innovative ideas.” For trade visitors, Bondexpo has a very high value, Andrea Werkmann affirms, because the entire industry comes together here: “Here, trade visitors get a broad overview of both new developments and basic technologies, all in one place.”