15th Bondexpo | October 4 to 7, 2022 | Messe Stuttgart

With a clear and consistent focus on the joining/bonding process chain through adhesive bonding, potting, sealing and foaming, the company offers cost-effective detailed and system solutions for current and future challenges in the field of joining and bonding a wide range of materials.

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Current topics on bonding technology

Bondexpo Specials

Fair partner

Consultation and contact

Trade fair project manager

Foreign representatives

Foreign representatives

Sigrid Jahn
InterMundio BV
Boylestraat 61
2563 EJ The Hague
Netherlands

+31 70 360 23 90
info@intermundio.com
www.intermundio.com

Hermann Bohle
Dragon Invest Co., Ltd. Shanghai
1203/1 Lane 258, Yong Xing Road
Shanghai 200071
P. R. China

+86 21 62 15 56 68
hermann.bohle@dragon-invest.com
www.dragon-invest.com

Edgar Mäder
Emtrad
Via Duccio Galimberti 7
12051 Alba (CN)
Italy

+39 01 73 28 00 93
info@emtrad.it
www.emtrad.it

Ben Huang
THETW Co, Ltd.
12F-1, No. 67 , Yonghe Rd. 1 Sec, Yonghe Dist,
New Taipei City 23445
Taiwan

+886-2 32 33 28 90
ben_huang@thetw.com
www.thetw.com

Shever Hsiao
THETW Co, Ltd.
12F-1, No. 67 , Yonghe Rd. 1 Sec, Yonghe Dist,
New Taipei City 23445
Taiwan

+886-2 32 33 28 90
shever_hsiao@thetw.com
www.thetw.com

Mehmet Ali Dincer
RFL FAIR
Merkez Mah. Sanayi Cad. Sener Apt. No: 35 Cat: 3
Yenibosna – 34197 Istanbul
Turkey

+90 21 24 52 03 64
info@rflfair.com
www.rflfair.com