Trend-Setting Meeting Place for the Bonding Technology Industry
With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
Sister Trade Fair
Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.
37th Motek – International trade fair for automation in production and assembly, 08.10.2018–11.10.2018, Stuttgart
3rd Motek India 13.12.2017–15.12.2017, Bombay Convention & Exhibition Centre Mumbai, Indien
News & Stories
The Smart Factory is Becoming Reality
Motek 2018 Assembly is Becoming More Digital
To an ever greater extent, companies are becoming aware of the fact that automation doesn’t mean a thing without digitalisation. Those who don’t deal with their processes digitally...
Clearly Sorted Assembly Technology and Handling Systems
Motek 2018 Successfully Continues Restructuring of Exhibition Offerings
At the beginning of February, just under 15 weeks after the last Motek and Bondexpo, three fourths of all available exhibition floor space has again already...
Power Trade Fairs Made by Schall
The new record-breaking figures we achieved during the last trade fair year with regard to exhibitor and visitor numbers, as well as the internationalism of our events, are our incentive for trade fair power in 2018!
Control...
Motek and Bondexpo in Digitalisation Fever
High Levels of Internationalism with 38,421 Expert Visitors from 104 Countries
Robot technology and handling systems, man-machine collaboration and safety, assembly solutions for production with flexible lot quantities and higher...
Trade Fair Films from Motek 2017!
Our sincere thanks go out to all exhibitors and expert visitors for a successful 36th Motek and 11th Bondexpo at the Stuttgart Exhibition Centre! We published trade fair films here every day covering current trade fair activities:...
Robot Boom and Digitalisation
The frequently alluded to “7-year itch” applies neither to the Motek international trade fair for automation in production and assembly nor to global robotics and automation business! Because Motek, as well as the complementary...
Bonding – Joining – Fastening
The exhibition portfolio of the Bondexpo international trade fair for bonding technology represents the logical extension of the process sequence for assembly technology. As a thematic and complementary “satellite” of the Motek...
Well Bonded
The advance of modern materials, hybrid materials and fibrous composite materials must be seen as an important driver for lightweight design in all conceivable industry sectors. However, considerable challenges arise in actual...
Multi-Functional Problem Solvers
Adhesives, and their specifically utilised counterparts, namely insulating, sealing, foam and encapsulation materials, are indispensable in modern production and assembly technology. Multi-functional solutions can be implemented...
Fastening Competence
Bondexpo and Motek present well-known, tried and tested, and above all innovative and new bonding, joining and fastening solutions – ranging from the materials to be processed right on up to efficient, qualitative and thus...
Clever Connections!
Bondexpo offers practical answers to current and future issues in the field of assembly, as well as for the accompanying joining and fastening processes. The range of applications for adhesives, sealants, insulation materials,...
