Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

Sister Trade Fair

Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.

40th Motek – International trade fair for automation in production and assembly, 04.10.2022 – 07.10.2022, Stuttgart

News & Stories

Bondexpo Specials

Communal Booth – Individual Presence, Joint Services

Motek/Bondexpo stands for outstanding engineering services in the field of efficient, automated manufacturing processes. Companies are offered the opportunity to present their solutions at a joint booth and thus be present...

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Exhibitor forum as Motek & Bondexpo highlight

The Exhibitor Forum, which is held on all days of the fair and is free of charge for trade visitors, has been very popular for years. Top-class speakers from exhibiting companies report in alternating lectures on the theory and...

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Foreign representatives