18th Bondexpo | 7 to 9 October 2025 | Messe Stuttgart

With a clear and consistent focus on the joining/bonding process chain through adhesive bonding, potting, sealing and foaming, the company offers cost-effective detailed and system solutions for current and future challenges in the field of joining and bonding a wide range of materials.

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One ticket - six trade fairs

In addition to Motek/Bondexpo, five other top-class trade fairs will be opening their doors at the Stuttgart Exhibition Center. With your Motek/Bondexpo ticket, you enjoy free admission to all events at the exhibition center.

Current Issues in Bonding Technology

Fair Partners

Consultation and contact

Trade fair project manager

Foreign representatives