Become an Exhibitor

Focus on Bonding Technology

The Bondexpo is the worldwide number one user meeting place. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials. This is also true not least for new requirements with respect to resource conservation as well as material and energy efficiency through material mix / hybrid designs for lightweight construction or miniaturisation for microsystems technology applications. Adhesion technology suppliers find the ideal setting here for presentation to the specialist public from the globalised world of production.

Bondexpo runs in parallel with Motek, the international trade fair for assembly, handling technology and automation. The trade fair group is an impressive testament to the need to think outside the box in order to be able to provide a complete representation of the process chains of production and assembly technology including basic bonding and joining technology by gluing.

 

15th Bondexpo

  • Stuttgart

16th Bondexpo

  • Stuttgart

Motek/Bondexpo 2021 - Live - Statements & Scenes

Exhibitor forum

As an exhibitor, you can take advantage of the opportunity of introducing your company to Bondexpo’s expert visitors by means of a presentation at the exhibitor forum.

Registration only possible via the online ordering system.

Online ordering system

Nomenclature

  • Assembly systems and basic systems
  • Handling technology
  • Process technology for joining, machining, inspection and identification
  • Components for special machine manufacturing
  • Software and services

Exhibitor Downloads

453 Exhibitors incl. Motek
25 Countries

Exhibitors

20.000 Visitors incl. Motek
42 Countries

Visitors

45.000 sqm incl. Motek
Area gross

sqm

Foreign representatives