Focus on Bonding Technology

The Bondexpo is the worldwide number one user meeting place. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials. This is also true not least for new requirements with respect to resource conservation as well as material and energy efficiency through material mix / hybrid designs for lightweight construction or miniaturisation for microsystems technology applications. Adhesion technology suppliers find the ideal setting here for presentation to the specialist public from the globalised world of production.

Bondexpo runs in parallel with Motek, the international trade fair for assembly, handling technology and automation. The trade fair group is an impressive testament to the need to think outside the box in order to be able to provide a complete representation of the process chains of production and assembly technology including basic bonding and joining technology by gluing.