15. June 2021

Software for assembly conquers Motek/Bondexpo 2021

Bondexpo Internationale Fachmesse für Klebtechnologie csm motek 2019 SHA 5683 bea 568ca7806b uai

This year’s Motek/Bondexpo is in full preparation as a presence trade fair. The industry is looking forward to the traditional trade fair duo, the 39th Motek – International Trade Fair for Production and Assembly Automation and the 14th Bondexpo – International Trade Fair for Adhesive Bonding Technology. The pleasing level of bookings proves how much the leading trade fair for the world of automation from 05. is expected by 08 October 2021. The topic of “Software for Assembly” and the “Arena of Integration” will occupy a central place in Hall 1.

For the first time at Motek 2021, a new exhibition area “Software for Assembly” will create a unique platform for the digitalization of manufacturing and assembly. The presentation is structured along the product lifecycle and covers several topics: Software for Product Lifecycle Management, for Sales, for Service and for Development and Design. Great attention is paid to software for manufacturing and assembly as well as machine-related software and control technology. In addition, the “Arena of Integration” (AoI) is being prepared as a show highlight: “The AoI will be further developed for Motek 2021 as a living centerpiece of the exhibition area ‘Software for Assembly’,” informs Mike Döring on the part of the project management at the trade fair organizer P.E. SCHALL GmbH & Co. KG. “Here, the networking of software and assembly technology in motion, the business processes mapped by software should be made vividly visible and tangible through exhibits.”

Assembly companies and their suppliers of assembly technology are one of the largest markets for operational software solutions. For these two target groups traditionally represented at the Motek trade fair, the digitization of assembly is a central, current challenge. “Decision-makers from sales and design are present on site as regular exhibitors at Motek,” Döring explains. “We bring them together with the right trade visitors at Motek/Bondexpo: Plant managers, planners and buyers.” In this way, users receive direct answers to their specific questions from the manufacturers of series-variant products.

Solo or as a joint stand: Motek/Bondexpo supports networking

The industrial manufacturing sector is continuously implementing networking, digitalization and automation. In line with the trade fair motto “automation intelligence for production and assembly”, Motek/Bondexpo transfers these topics into practice. Exhibitors can realize their presentations with their own space or also via a joint stand.

“We support the networking that takes place in practice,” Döring says, explaining the collaborations at various levels. Therefore, many interesting total solutions will be on display at the trade show, also for new markets.

The Motek/Bondexpo trade show duo once again demonstrates the optimal interaction of all participants. The complementary Bondexpo focuses on industrial joining and bonding technology: It can be used to join almost any combination of materials, both identical and dissimilar, without losing the material properties and associated benefits. The trade fair highlight of the fall from 05. to 08 October 2021 in Stuttgart is firmly in the calendar as a personal meeting of an excellent business community!