Bondexpo – Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

Sister Trade Fair

Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.


36th Motek – International Trade Fair
for Production and Assembly Automation




2. Motek India
07.04.2016 – 09.04.2016
Gandhinagar, India



Motek and Bondexpo on Course for Digitalisation

35th Motek and 10th Bondexpo – Quality Prevails! Tradition and progress, as well as a consistent alignment to actual practice und a forward-looking approach – these and further attributes apply to the Motek international on


“My Trade Fair Visit” – Convenient Web Tool for Expert Visitors

With the help of the new “My Trade Fair Visit” web tool, expert visitors can efficiently and conveniently plan their individual schedules for the event. Highly practical: Users can combine their planned visits to exhibitors on


10th Bondexpo with Supplementary Technical Congress

Bondexpo 2016 – Bonding – Joining – Fastening – Sealing An appropriate gift for a tenth anniversary: now that the Bondexpo international trade fair for bonding technology has succeeded in evolving from small beginnings into on