With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
Together with the concurrent Motek trade fair and the Mycrosys technology park, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.
The Motek international trade fair for production and assembly automation has been convincing the expert visitors for decades with its directly exploitable added value. This is the result of the declared strategy of Motek trade...
Motek und Bondexpo Setting Worldwide Standards in Stuttgart from the 7th through the 10th of October, 2013! Canvassing and the registration phase are still running at full bore, but P. E. Schall GmbH & Co. KG is already able to...
Bonding, sealing, insulation, encapsulation and foaming – the Bondexpo international trade fair for bonding technology has quickly established itself as a globally recognised information, communication and business platform with...