10th Bondexpo – International trade fair
for bonding technology

Bondexpo – Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

Sister Trade Fair

Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.


35th Motek – International Trade Fair
for Production and Assembly Automation




2. Motek India
07.04.2016 – 09.04.2016
Gandhinagar, India



First Bonding Technology Congress for Lightweight Design

Bondexpo: OTTI Presents Industrial Lightweight Design Solutions in Theory and Practice The East-Bavarian Institute for Technology Transfer (OTTI e.V.) will demonstrate the controllability of bonding processes and the...read on


Strong Partners for Bonding Technology Congress on Lightweight Design

Isgatec Exhibits Latest Technologies for Industry Concurrent to Bondexpo Bonding technology and lightweight design belong together. The complementary fields of technology will be dealt with comprehensively in theory and practice...read on


Bonding Technology Congress with Support from Authoritative Partners

Bondexpo Knowledge Exchange: Cooperation Between Schall and Lightweight Design Cluster Lightweight solutions are a significant criterion for future technical and economic success in a wide a wide variety of industry sectors....read on

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