Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

 


Sister Trade Fair

Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.

37th Motek – International trade fair for automation in production and assembly, 08.10.2018–11.10.2018, Stuttgart

3rd Motek India 13.12.2017–15.12.2017, Bombay Convention & Exhibition Centre Mumbai, Indien

News & Stories

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