17th Bondexpo | 8 to 11 October 2024 | Messe Stuttgart

With a clear and consistent focus on the joining/bonding process chain through adhesive bonding, potting, sealing and foaming, the company offers cost-effective detailed and system solutions for current and future challenges in the field of joining and bonding a wide range of materials.

Exhibitor InformationVisitor Information
YouTube

By loading the video you accept YouTube's privacy policy.
Learn more

Load video

Current Issues in Bonding Technology

Bondexpo Specials

Fair Partners

Consultation and contact

Trade fair project manager

Foreign representatives

Foreign representatives

Hermann Bohle
Dragon Invest Co., Ltd. Shanghai
402/12, Lane 1339, Zhen Guang Road,
Shanghai 200333
P. R. China

+86 21 62 15 56 68
hermann.bohle@dragon-invest.com
www.dragon-invest.com

Edgar Mäder
Emtrad
Via Duccio Galimberti 7
12051 Alba (CN)
Italy

+39 01 73 28 00 93
info@emtrad.it
www.emtrad.it

Ben Huang
THETW Co, Ltd.
12F-1, No. 67 , Yonghe Rd. 1 Sec, Yonghe Dist,
New Taipei City 23445
Taiwan

+886-2 32 33 28 90
ben_huang@thetw.com
www.thetw.com

Shever Hsiao
THETW Co, Ltd.
12F-1, No. 67 , Yonghe Rd. 1 Sec, Yonghe Dist,
New Taipei City 23445
Taiwan

+886-2 32 33 28 90
shever_hsiao@thetw.com
www.thetw.com

Mehmet Ali Dincer
RFL FAIR
Merkez Mah. Sanayi Cad. Sener Apt. No: 35 Cat: 3
Yenibosna – 34197 Istanbul
Turkey

+90 21 24 52 03 64
info@rflfair.com
www.rflfair.com