With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
Together with the concurrent Motek trade fair and the Mycrosys technology park, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.
34th Motek and 9th Bondexpo Clearly on Course for Growth MAP, CIM, Industry 4.0 – the catchwords change and integration capabilities advance, but the promise of benefits frequently lags behind the expectations! Fundamental...
Motek and Bondexpo 2015 – Heading in New Directions! Practical necessities sometimes lead to new opportunities! It is in this spirit that the new hall layout for the two globally recognised industry events, namely the Motek...
Motek with New Hall Layout as of 2015 The decision to expand exhibition floor space with an additional hall 10 due to great demand can also be traced back to the urgently required reorganisation of the hall layout for the Motek...