8th Bondexpo – International trade fair
for bonding technology
06.–09. OCTOBER 2014 STUTTGART

Bondexpo – Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
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Sister Trade Fair

Together with the concurrent Motek trade fair and the Mycrosys technology park, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.

 


33rd Motek – International Trade Fair
for Production and Assembly Automation

 

 


7th Microsys – Technology park
for micro- and nanotechnology

 

News

25.03.2014

Motek International Trade Fair for Production and Assembly Automation

33rd Motek and 8th Bondexpo in Great Demand Still 6 months to go before Motek 2014 opens its doors and the trend barometer is already indicating unbroken great demand for the leading international trade fair in the field of...read on


27.02.2014

33rd Motek and 8th Bondexpo Off to a Great Start for 2014

The success story of the globally esteemed trade fair duo for complete process sequences including Motek und Bondexpo, which is widely recognised as a benchmark event, is carrying on unbridled despite the altered competitor...read on


06.02.2014

Motek and Bondexpo 2014 – the Process-Oriented Trade Fair Duo

Motek and Bondexpo on Course for Success More exhibitors, higher levels of internationalism, unprecedented participation of equipment manufacturers and increased numbers of visitors from inside, and especially from outside of...read on