8th Bondexpo – International trade fair
for bonding technology
06.–09. OCTOBER 2014 STUTTGART

Bondexpo – Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
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Sister Trade Fair

Together with the concurrent Motek trade fair and the Mycrosys technology park, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.

 


33rd Motek – International Trade Fair
for Production and Assembly Automation

 

 


7th Microsys – Technology park
for micro- and nanotechnology

 

News

24.09.2014

Motek and Bondexpo 2014 – Trade Fair Duo with Worldwide Offerings

33rd Motek and 8th Bondexpo with 1057 Exhibitors from 25 Countries System solutions expertise and process know-how – this is precisely what the Motek international trade fair for production and assembly automation stands for, as...read on


18.08.2014

Exhibitor Forum Bondexpo/ Motek 2014

Exhibitors at the 8th Bondexpo and33rd Motek  will introduce their companies, new products, innovations and much more in short presentations held each day at the forum in the foyer of hall 1 at booth 1915. Admission is free of...read on


22.07.2014

33rd Motek and 8th Bondexpo with More than 1000 Exhibitors Already

Motek 2014 Presents Collaboration Between People and Automation just less than three months before the 33rd Motek international trade fair for production and assembly automation and the 8th Bondexpo international trade fair for...read on