With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.
Motek: show time for automated production and assembly The complementary, dual, processing chain is being presented in the best condition more than seven weeks before beginning the 35th Motek exhibition and the 10th Bondexpo...
Bondexpo: OTTI Presents Industrial Lightweight Design Solutions in Theory and Practice The East-Bavarian Institute for Technology Transfer (OTTI e.V.) will demonstrate the controllability of bonding processes and the...
Isgatec Exhibits Latest Technologies for Industry Concurrent to Bondexpo Bonding technology and lightweight design belong together. The complementary fields of technology will be dealt with comprehensively in theory and practice...