11th Bondexpo – International trade fair
for bonding technology
09.–12. OCTOBER 2017 STUTTGART

Bondexpo – Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
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Sister Trade Fair

Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.

 


36th Motek – International Trade Fair
for Production and Assembly Automation

 

 

 

2. Motek India
07.04.2016 – 09.04.2016
Gandhinagar, India

News

23.06.2017

Motek and Bondexpo in Formation Flight!

  Motek and Bondexpo Already Approaching the 900 Mark Mid-June 2017, and thus 15 weeks before the 36th Motek and the 11th Bondexpo open their doors, a full house is shaping up at the Stuttgart Exhibition Centre. All of the...read on


20.04.2017

Motek and Bondexpo Headed for More Than 1000 Exhibitors!

Staying on Course for Success with Optimised Strategic Alignment The Motek international trade fair for automation in production and assembly and the Bondexpo international trade fair for bonding technology are casting their...read on


18.10.2016

Motek and Bondexpo on Course for Digitalisation

35th Motek and 10th Bondexpo – Quality Prevails! Tradition and progress, as well as a consistent alignment to actual practice und a forward-looking approach – these and further attributes apply to the Motek international trade...read on


 

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