10th Bondexpo – International trade fair
for bonding technology

Bondexpo – Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

Sister Trade Fair

Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.


35th Motek – International Trade Fair
for Production and Assembly Automation




2. Motek India
07.04.2016 – 09.04.2016
Gandhinagar, India



First Bonding Technology Congress Held by P. E. Schall GmbH & Co. KG

Intensified Exchange of Knowledge: World-Class Meeting of the Minds Concurrent to Bondexpo 2016 Bonding technology is an issue with a future. There’s hardly a car, a notebook or an industrial process that can get along today...read on


Motek – More Business Power with Expanded Technical Content

Motek 2016 – Leading Trade Fair for Handling and Assembly Technology – Based on Actual Praxis, for Actual Practice The content and business offensive of the world’s leading Motek trade fair continues! Already now, at the...read on


Schall Trade Fair Promoters Invest in the Future

Private trade fair promoters P. E. Schall GmbH & Co.KG are getting ready for the future by kicking off the 2016 trade fair year with further development of the Bondexpo international trade fair for bonding technologies! A new...read on

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