8th Bondexpo – International trade fair
for bonding technology

Bondexpo – Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

Sister Trade Fair

Together with the concurrent Motek trade fair and the Mycrosys technology park, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.


33rd Motek – International Trade Fair
for Production and Assembly Automation



7th Microsys – Technology park
for micro- and nanotechnology




Exhibitor Forum Bondexpo/ Motek 2014

Exhibitors at the 8th Bondexpo and33rd Motek  will introduce their companies, new products, innovations and much more in short presentations held each day at the forum in the foyer of hall 1 at booth 1915. Admission is free of...read on


33rd Motek and 8th Bondexpo with More than 1000 Exhibitors Already

Motek 2014 Presents Collaboration Between People and Automation just less than three months before the 33rd Motek international trade fair for production and assembly automation and the 8th Bondexpo international trade fair for...read on


Motek 2014 – Exhibitor List and Hall Floor Plans Available Online as of Immediately!

Motek and Bondexpo Break the 900 Mark for Exhibitor Numbers The tentative announcement included in the last press release has now been firmed up: the 33rd Motek and the 8th Bondexpo are demonstrating even more power than usual...read on