10th Bondexpo – International trade fair
for bonding technology

Bondexpo – Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

Sister Trade Fair

Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.


35th Motek – International Trade Fair
for Production and Assembly Automation




2. Motek India
07.04.2016 – 09.04.2016
Gandhinagar, India



10th Bondexpo with Supplementary Technical Congress

Bondexpo 2016 – Bonding – Joining – Fastening – Sealing An appropriate gift for a tenth anniversary: now that the Bondexpo international trade fair for bonding technology has succeeded in evolving from small beginnings into a...read on


The 35th Motek and the 10th Bondexpo attract more than 1,000 exhibitors

Motek: show time for automated production and assembly The complementary, dual, processing chain is being presented in the best condition more than seven weeks before beginning the 35th Motek exhibition and the 10th Bondexpo...read on


First Bonding Technology Congress for Lightweight Design

Bondexpo: OTTI Presents Industrial Lightweight Design Solutions in Theory and Practice The East-Bavarian Institute for Technology Transfer (OTTI e.V.) will demonstrate the controllability of bonding processes and the...read on