With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.
Motek and Bondexpo – Industry Event with New Dimensions The Motek international trade fair for production and assembly automation and the Bondexpo international trade fair for bonding technologies were held in Stuttgart from the...
As of immediately, you can view the Schall Trade Fair Websites as a mobile version at your smartphone or tablet when you’re on the road. Take advantage of this opportunity in order to prepare yourself optimally for your visit to...
34th Motek and 9th Bondexpo Clearly on Course for Growth MAP, CIM, Industry 4.0 – the catchwords change and integration capabilities advance, but the promise of benefits frequently lags behind the expectations! Fundamental...