With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
Together with the concurrent Motek trade fair and the Mycrosys technology park, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.
The success story of the globally esteemed trade fair duo for complete process sequences including Motek und Bondexpo, which is widely recognised as a benchmark event, is carrying on unbridled despite the altered competitor...
Motek and Bondexpo on Course for Success More exhibitors, higher levels of internationalism, unprecedented participation of equipment manufacturers and increased numbers of visitors from inside, and especially from outside of...
32nd Motek Excels with 36,967 Expert Visitors from 101 Countries With 1056 exhibitors from 21 nations and 36,967 expert visitors from 101 countries around the world, the internationally leading Motek trade fair and concurrently...