9th Bondexpo – International trade fair
for bonding technology
05.–08. OCTOBER 2015 STUTTGART

Bondexpo – Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
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Sister Trade Fair

Together with the concurrent Motek trade fair and the Mycrosys technology park, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.

 


34th Motek – International Trade Fair
for Production and Assembly Automation

 

 


1. Motek India
05.02.2015 - 07.02.2015
Ahmedabad, India

News

28.05.2015

Industry 4.0? Motek and Bondexpo Present Process Networking in Actual Practice!

34th Motek and 9th Bondexpo Clearly on Course for Growth MAP, CIM, Industry 4.0 – the catchwords change and integration capabilities advance, but the promise of benefits frequently lags behind the expectations! Fundamental...read on


02.04.2015

Motek and Bondexpo Now Already with Nearly 800 Exhibitors

Motek and Bondexpo 2015 – Heading in New Directions! Practical necessities sometimes lead to new opportunities! It is in this spirit that the new hall layout for the two globally recognised industry events, namely the Motek...read on


12.02.2015

New Construction of Hall 10 at Stuttgart Exhibition Centre Casts its Shadow in Advance

Motek with New Hall Layout as of 2015 The decision to expand exhibition floor space with an additional hall 10 due to great demand can also be traced back to the urgently required reorganisation of the hall layout for the Motek...read on


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