5 May 2026

The Entire Process Chain – Interacting for Cost-Effective Production

Bondexpo Internationale Fachmesse für Klebtechnologie 250108 presseinfo motek bondexpo scaled 1 uai

Suppliers and users of production technologies are cordially invited to the 43rd Motek international trade fair for automation in production and assembly, held in conjunction with the 18th Bondexpo international trade fair for bonding technology. This three-day trade fair highlight, taking place in Stuttgart from 6 to 8 October 2026, will provide the industry with far-reaching synergies and new opportunities for collaboration: concurrent staging of two trade fairs, namely VISION and Motek/Bondexpo, has enabled the organisers to create a valuable platform for technological integration and networking.

Exhibitors and expert visitors are looking forward to Motek/Bondexpo 2026, which once again promises to set new benchmarks for the industrial manufacturing sector with forward-looking, practical solutions. Anyone from the manufacturing industries looking to automate a process or function, regardless of the sector – for example machine building, equipment and systems manufacturing, automotive engineering and vehicle production, sheet metal working, plastics processing, metalworking and processing, woodworking, electronics and electrical engineering, laboratory automation, healthcare and medical technology – will find the right components and solutions at Motek/Bondexpo. The organisers of VISION 2026 (Messe Stuttgart) and the Motek/Bondexpo trade fair duo (P. E. Schall) are offering the industry real added value this year by holding the events concurrently at the same venue. VISION, as the leading event for image processing, and Motek/Bondexpo, as the proven platform for production automation, complement each other ideally in terms of both expertise and subject matter.

In Focus: Integrated Manufacturing through Collaboration and Synergy

“Motek/Bondexpo’s spectrum of topics covers the entire process sequence for economical automation in production and assembly”, stresses Rainer Bachert, long-standing project manager for the trade fair duo at event promoters P. E. Schall. “The next Motek/Bondexpo will reflect this integrated approach. In this way, manufacturing companies can generate tangible economic benefits for day-to-day operations thanks to diverse synergies,” says Bachert. For example, this is demonstrated in the field of feed technology where image recognition and AI-assisted image processing are being linked to an ever-greater extent. “Part sorting, separation and handling are no longer standalone processes … they’re integrated into fully automated systems that pool the technical know-how of several partners. Integrated systems like these are the future of manufacturing technology.”

This integrative, holistic approach to systems engineering will be exemplified this year at the “Industrial Interactive Zone”: within the framework of a competition, the Industrial Interactive Zone will provide visitors with first-hand insights into process integration, rapid commissioning and flexible format changeovers. Companies are invited to work together with technology partners to provide a comprehensive solution to a given challenge by integrating various equipment functions into a single, integrated system. By way of example, competition entrants are asked to demonstrate how different functions within a system can work together seamlessly. The goal is to illustrate that automation solutions can be implemented with ease when they come from a single source and are designed as an integrated system. Further information is available to interested parties here: https://www.motek-messe.de/en/specials/industrial-interactive-zone-at-motek-bondexpo-2026-people-machines-teamwork/

Automated, Integrated Processes for Greater Cost-Effectiveness

Handling, object recognition, feeding and assembly are at the core of product manufacturing – processes that have long since been automated and integrated with the help of robotics, sensor technology and software. “It’s vitally important for manufacturing companies to achieve efficiency in all areas and at all levels,” notes Rainer Bachert. “The key to reducing costs and achieving economic efficiency lies in exploiting every possible synergy. Motek/Bondexpo 2026 intends to provide fresh impetus in this regard. Exhibitors and expert visitors will benefit from a widespread target group and the optimal use of resources at this practical business and communication platform.”
Alongside VISION and Motek/Bondexpo, EFX (Expo for Electronics Manufacturing) and Quantum Effects will also take place at the same time. EFX is a new industry event for electronics manufacturing, showcasing trends and technologies in the production of electronic components. As a trade fair and conference for quantum technologies, Quantum Effects bridges the gap between science, startups and industry. And thus parallel staging of four top-tier technology trade fairs provides a significant boost to the entire region and strengthens its international competitiveness. Bringing together four trade fairs at a single location will establish Stuttgart as a hub for decision-makers, developers and visionaries from around the world. A single ticket entitles visitors to attend all four events.

Keep yourself well informed!

To the websites:
www.motek-messe.de/en/
www.bondexpo-messe.de/en/

Technical information on the trade fair and the industry:
https://www.bondexpo-messe.de/en/news-stories/

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64 Years of Trade Fairs for Markets – Schall Trade Fairs’ Recipe for Success

Schall has developed successful business platforms with internationally recognised trade fairs for quality assurance (Control), optical technologies, components and systems (Optatec), stamping technology (Stanztec), automation in production and assembly (Motek), bonding technology (Bondexpo), plastics processing (Fakuma), sheet metal working (Blechexpo) and joining technology (Schweisstec). This has given rise to completely new markets in various sectors, whose protagonists are characterised by a high level of innovative strength, comprehensive system competence and practical application solutions.