Trend-Setting Meeting Place for the Bonding Technology Industry

With the Bondexpo international trade fair for bonding technology, exhibition company P. E. Schall GmbH & Co. KG has succeeded in establishing the worldwide number one user meeting place within a very short period of time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

Sister Trade Fair

Together with the concurrent Motek trade fair, Bondexpo forms a powerful trade fair group, which provides an ideal platform for future issues.

39th Motek – International trade fair for automation in production and assembly, 05.10.2021 – 08.10.2021, Stuttgart

News & Stories

Bondexpo Specials

Special trade fair guide for assembly systems fabrication

The special trade fair guide for assembly systems fabrication and robot system integrators lists all of the corresponding manufacturers and distributors who exhibit at Motek and Bondexpo. More than 200 competent industry partners...

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Special trade fair guide for joining technology

The special trade fair guide for joining technology lists all of the manufacturers and distributors who offer components, modules, subsystems, complete solutions and materials for mechanical joining (bonding, clinching, riveting,...

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Exhibitor forum as Motek & Bondexpo highlight

The exhibitor forum, which is held on all trade fair days and is free of charge for the expert visitors, has been enjoying great popularity for years. During the course of more than 30 alternating presentations, world-class...

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Foreign representatives